Rigid PCB process introduction

PCB (Printed Circuit Board) processing technology involves a series of precise steps to create the circuit boards that are essential for electronic devices. Below is a detailed explanation of the PCB processing technology flowchart in English, based on the provided search results.

The first step in PCB processing is the design process, which includes several key stages:

• Circuit Design: Using EDA (Electronic Design Automation) software such as Altium Designer or Cadence, engineers design the circuit schematic and layout. This stage involves creating the physical layout of the PCB, including the placement of components and the routing of electrical connections. Normaly customer provide the original files to PCB manufacturing directly, the deisgn team of the manufacturing will prepare the manufacturing instruction to the plant process.
• Output Gerber Files: After the design is completed, Gerber files are generated. These files are used in the manufacturing process to transfer the circuit design onto the PCB material. Each Gerber file corresponds to a physical layer of the PCB, such as the top signal layer, bottom ground plane, and solder mask layers.
• Plating process: It includes PTH plating,panel plating and pattern plating.Plating copper in the hole wall and the pattern surface to ensure connection performance.
• Etching process: Acid/ Alkaline etching (removal excess cooper foil and stripping residual photoesist film.

The manufacturing process of PCBs is complex and involves multiple steps to ensure precision and quality. Here is a breakdown of the main steps:

• Material Preparation: The base material, typically copper-clad laminate, is prepared. This involves cutting the large sheets of material into smaller panels according to the design specifications.
• Inner Layer Processing: The inner layers of the PCB are processed by transferring the circuit pattern onto the copper-clad laminate using a photoresist process. This involves exposing the panel to UV light through a photomask, developing the image, and then etching away the unwanted copper to leave the circuit pattern.
• Lamination: For multi-layer PCBs, the inner layers are stacked together with prepreg (a type of insulating material) and laminated under high pressure and temperature to form a single unit.
• Drilling: Holes are drilled through the laminated panel to create vias (vertical interconnect accesses) that connect different layers of the PCB. These holes are then plated with copper to ensure electrical connectivity.
• Outer Layer Processing: Similar to the inner layer processing, the outer layers are processed to create the final circuit pattern. This involves another photoresist process, followed by etching to remove the unwanted copper.

After the basic circuit structure is formed, the PCB undergoes surface treatment and finishing processes:

• Solder Mask Application: A solder mask, or solder resist, is applied to the PCB to protect the circuit from oxidation and to prevent solder bridges during assembly. The solder mask is applied using a screen printing process and then cured.
• Silkscreen Printing: Silkscreen printing is used to apply component designators, part numbers, and other markings onto the PCB. This helps in the assembly process and for identification purposes.
• Surface Finish: The exposed copper areas of the PCB are treated with a surface finish to improve solderability and protect the copper from corrosion. Common surface finishes include gold plating, silver plating, and tin-lead plating.

The final step in the PCB processing technology is quality inspection and testing to ensure that the PCB meets the required standards:

• Visual Inspection: The PCB is visually inspected for any defects such as scratches, bubbles, or misalignments.
• Electrical Testing: Electrical tests are performed to verify the functionality of the PCB. This includes testing for continuity, insulation resistance, and other electrical parameters.
• Reliability Testing: Reliability testing is conducted to assess the PCB’s performance under various environmental conditions, such as temperature cycling and humidity testing.

The PCB processing technology flowchart encompasses a wide range of steps, from initial design to final testing, each requiring precision and expertise. By following this flowchart, manufacturers can produce high-quality PCBs that meet the demands of modern electronic devices. The process is a blend of mechanical, chemical, and electronic engineering, making it a cornerstone of the electronics industry.

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